| Supplier Device-Gehäuse: | 676-FBGA (27x27) |
|---|---|
| Geschwindigkeit: | 166MHz |
| Serie: | SmartFusion®2 |
| Primärattribute: | FPGA - 90K Logic Modules |
| Peripherals: | DDR, PCIe, SERDES |
| Verpackung: | Tray |
| Verpackung / Gehäuse: | 676-BGA |
| Betriebstemperatur: | -40°C ~ 100°C (TJ) |
| Anzahl der E / A: | 425 |
| MCU RAM: | 64KB |
| MCU-Flash: | 512KB |
| Core-Prozessor: | ARM® Cortex®-M3 |
| Connectivity: | CAN, Ethernet, I²C, SPI, UART/USART, USB |
| Die Architektur: | MCU, FPGA |
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